A new Sony smartphone has popped un in the Chinese benchmark test AnTuTu, one that will be equipped with the most powerful Qualcomm chipset for 2018.
We don’t know fo sure what Sony plans with this phone, but given the moment it appeared at AnTuTu, we think it could be one of the new Xperias that will be unveiled at the Mobile World Congress (MWC) 2018, which runs between 26 February and March 1 in Barcelona.
The phone appears with the Sony HB266 model number and was tested with Android 8.0 Oreo on board. The phone has the most powerful Qualcomm mobile platform for 2018, a Snapdragon 845 with Adreno 630 GPU.
The information from AnTuTu also reveal 4 GB of RAM and 64 GB of internal storage space. As for the screen, it will have a Full HD+ resolution (2168×1080 pixels), which means it will have an 18:9 aspect ratio.
The previous rumors indicated for the same this particular model a 5.48-inch display, a dual camera with 12MP sensors and a front for 15MP selfie snapper.
Also at MWC 2018, Sony should also unveil the Xperia XZ Pro flagship, the successor of the Xperia XZ Premium introduced at MWC 2017.