Rumors about iPhone 8 to be unveiled later than the iPhone 7S models, in a separate event, yet new report from Asia assures Apple fans, that the unveiling will not be postponed, but when it comes to shipments there might me some delays.
According to new reports, laminate motherboard suppliers Zhen Ding, and Kinsus Interconnect have worked out difficulties, and are ready to ramp up iPhone parts in June. TSMC is ready to go with the “A11” chip and will also start producing in mass quantities on June 10, with volume quantities arriving at Foxconn in the second half of July.
At the same time, the report alleges that iPhone assemblers Foxconn Electronics, Winstron and Pegatron have started the hiring surge process, and required training, to have an adequate work force on hand.
Multiple venues declared in April that the “iPhone 8” would ship significantly later than “normal” iPhone timetables. While the reports stated that the phone would launch alongside the “iPhone 7s” family in Apple’s regular September event, the April accounts noted that it may not ship until significantly later.
With a complete redesign said to be forthcoming in the device implementing a curved glass back with wireless charging, some reports have pegged the starting price of the “iPhone 8” at more than $1,000.